Twin 40 mm Bofors guns Scale 1:700 Metallic Details MDR70004

Metallic Details MDR70004 is a 3D-printed resin set of twin 40 mm Bofors gun mounts for 1/700 ship model kits. The set is designed for building 10 guns, making it practical for projects that need repeated deck fittings.

At 1/700, weapon mounts are highly visible but often simplified. These parts focus on cleaner shapes and a more consistent “twin-gun” look across multiple positions on the model.

Twin 40 mm Bofors mounts appear on a wide range of ship builds, but placement and quantity depend on the specific vessel and fit. Use the set to match your chosen reference layout rather than treating it as a one-size pattern.

For modelers: plan locations early and mark alignment lines on the deck before drilling or gluing. Test-fit each mount, then add them late in the build to reduce handling damage. For repeatable spacing, make a simple placement jig from thin plastic strip and check that both barrels sit parallel before the glue sets.

Product specifications

• Subject: Twin 40 mm Bofors guns
• Variant / Family: Twin mount (quantity and placement are build-dependent)
• Scale: 1/700 (also written as 1:700)
• Product type: 3D Printed Set
• Type of equipment: Ship/Fleet
• Recommended kit: for Any / Universal 1/700 ship kits
• Manufacturer: Metallic Details
• Country of manufacture: Ukraine
• Material: Resin (3D-printed)
• SKU: MDR70004

This item is part of Metallic Details and belongs to Aftermarket and Guns. For related builds, browse Fleet and Diorama.

FAQ

How many gun mounts are included in the set?

The set contains 3D-printed parts for building 10 guns.

Do I need to drill locating holes on the deck?

It depends on your kit and chosen placement. Dry-fit first; drilling small locating holes can help keep alignment consistent, especially when adding multiple mounts.

What glue is suitable for these 3D-printed resin parts?

Use CA (super glue) for quick attachment or epoxy if you want more working time. Keep contact points clean and dry-fit before final bonding.